Lignin as a Major Component of an Intumescent Fire Retardant System for Biopolyester
Résumé
This work is focused on the preparation and the optimization of a biobased
intumescent fire-retardant system (IFR) which was applied to a biopolymer such as PLA.
This aliphatic biopolyester is obtained from agricultural plants and is recyclable and
compostable in specific conditions. However, it has a poor thermal stability [1] and is very
sensitive to hydrolysis [2]. In order to respect fire security standards, an IFR was designed
using ammonium polyphosphate (APP), a common fire retardant and lignin which is a
biobased by-product of the paper industry. Lignin has a good thermal stability and the ability
to retard fire in composite materials by promoting the formation of char in association with
APP [3]. The aim of the study is the optimization of the IFR and the chemical modification of
lignin in order to prevent a trans-esterification between PLA and lignin that may break the
polyester macromolecule. The first part of the study shows that an optimized ratio between
APP and lignin is situated around 17/3. At this ratio, the IFR is more efficient with a
significant reduction of the heat release rate (HRR) and a good fire retardancy capability
(Figure 1). In addition, an encapsulated APP was also tested with lignin. The encapsulant
improved the flame retardancy of the biocomposite with an enhancement of the char
promotion. Finally, the last part of the work was focused on the chemical modification of
lignin with esterification or phosphorylation. Chemical treatments showed an improvement of
the quality of the PLA/lignin adhesion, due to the modification of the surface properties of
lignin. The incorporation of phosphorus with lignin favors the intumescent reaction and the
char promotion directly on the lignin particle. As a conclusion, lignin in association with APP
was found to be efficient as IFR component for PLA, and beneficial as reinforcement for this
polymer, applying adequate treatments to improve lignin surface properties and then the
compatibility with PLA.
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